[PDF.45uh] High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects)

High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects)

[PDF.gq61] High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects)

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 | #6291648 in Books |  Springer |  1998-10-31 | Original language:English | PDF # 1 |  9.21 x.50 x6.14l,.83 | File type: PDF | 158 pages

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||1 of 2 people found the following review helpful.| The only one on this subject|By A Customer|For what I know this is the only book on the subject. It gives a detailed review of all the problems and solutions and enables to approach correctly the package modelization problem. I found it very usefull. For sure it worths the price.

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design o...

You easily download any file type for your device.High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects)   |  Luc Martens. Just read it with an open mind because none of us really know.

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